Injection Molding Solutions for 3C Electronics

Industries
The 3C electronics industry—covering computers, communications, and consumer electronics—is driven by fast-paced innovation and strict demands for precision and miniaturization. Products integrate complex components and advanced materials to meet high expectations for functionality and durability. Manufacturers must rapidly adapt to new designs and materials while safeguarding quality, efficiency, and repeatability.

Smartphone & Tablet Parts

Thin-wall housings, frames, and optical modules demand ultra-fast cycles, dimensional accuracy, and flawless surfaces for next-gen mobile devices.

Laptop & PC Components

Covers, frames, keyboards, and casings require high rigidity, precision, and repeatability, enabling lightweight yet durable portable computing.

Semiconductor Wafer Carriers

High-purity, antistatic carriers ensure safe handling, transport, and storage of wafers, meeting strict cleanliness and dimensional stability standards.

LED Brackets & Display Frames

Compact, heat-resistant components for lighting and displays, supporting conductivity and efficient thermal management in mass production.

Connectors & Sockets

High-cavity precision parts with ultra-thin walls, essential for stable signal transmission in communication and electronic devices.

Precision Gears & Micro Parts

Plastic gears and drive elements replace metals, offering lightweight, low-noise, and cost-effective solutions in robotics and 3C devices.

Contact Lens Molds & Cases

Ultra-clean PP/PBT molding with tight thickness and curvature control. Requires high repeatability, short cycles, and automated handling/packaging in controlled environments.

Technology to the Point

Purpose-built for 3C: ultra-fast, precise, and stable. From thin-wall housings to optical micro-parts, our electric and servo-hydraulic platforms deliver repeatability, cleanroom readiness, and smart automation—cutting cycle times, scrap, and energy per part.

Multi-Component

From smartphone housings to connectors, Haitian electric and servo-hydraulic platforms master 2K–6K with high repeatability. Modular layouts and stable handling enable efficient, high-quality multi-material production.

High-Response Systems

160–500 mm/s with ~2g acceleration and precise V/P control. Multiple accel/decel profiles, HPM overfill limits, and AI mold protection stabilize high-cavity, optical and micro parts—far beyond thin-wall use.

LSR Molding

Dedicated LSR units with precise dosing, self-locking nozzles, vacuum control, and cold runners. Perfect for micro-seals and 2K covers in clean environments; repeatable and easy to integrate with automation.

Metal & Ceramic

Zhafir PIM machines deliver stable high-pressure control for complex MIM/CIM parts—foldable screen hinge, watch case, fiber optic ferrule.. End-to-end know-how from feedstock to sintering supports high yield and tight dimensions.

Nano-Molding

NMT on Haitian machines bonds plastic to metal for thin, lightweight structures with a metal look. Fast acceleration and 200–300 MPa pressure enable reliable anchoring of PPS/PBT/PA to treated alloys.

Injection compression & IMD

Injection compression secures thickness and flatness in large, thin parts. Combined with IML, IMD/IME, Haitian enables seamless, functional surfaces with circuits or graphics for laptops and phones.

Machine Solutions for 3C Industry

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